9
2000
IBM
begins production of powerful new microchips for servers, communications equipment and
pervasive computing products, using the most advanced chip making technology ever developed.
The new technology named CMOS 9S unites for the first time
IBM
innovations in copper
wiring, silicon on insulator transistors and improved, low k dielectric insulation to build chip
circuits nearly 800 times thinner than a human hair.
Scientists in
IBM
laboratories in New York and California combine nanotechnology with
chemistry to make a radically new class of magnetic materials that may allow future computer
hard disks and other data systems to store more than 100 times more data than current products.
IBM
, Infineon Technologies, and
UMC
announce plans to jointly develop advanced technologies
for use in the production of logic chips with circuit sizes from 0.13 to 0.10 micron.
IBM
says it is
developing a series of chips based on InfiniBand technology to help link multiple computer
systems and peripherals such as hard drives to work together as a single high performance
server.
IBM
researchers unveil
IBM
Memory eXpansion Technology that doubles the memory capacity
of computer servers, a breakthrough that could save Internet Service Providers and other large
technology installations millions of dollars.
IBM
announces an initial $100 million investment to develop information technology solutions
and partnerships to enable the breakthrough work being conducted to interpret the complex
genetic code.
IBM
and NuTec Sciences, Inc., report they are building the world's largest
commercial supercomputer a 7.5 teraflop computing cluster which NuTec will use to
investigate how genes interact in the human body to cause life threatening diseases.
Scientists from
IBM
, Compaq and AltaVista compete the first comprehensive map of the
World Wide Web and uncover divisive boundaries between regions of the Internet that can make
navigation difficult.
IBM
ships the world's clearest computer display 12 times sharper than current displays ten
years sooner than thought possible.
Facilities
IBM
makes the largest capital investment in its history $5 billion and announces plans in
October to build the world's most technologically advanced chip making facility in East Fishkill,
New York. The new $2.5 billion facility will combine for the first time anywhere
IBM
chip
making breakthroughs such as copper interconnects, silicon on insulator and low k dielectric
insulation on 300mm wafers. Planned to begin operations in late 2002, the new facility will add
1,000 new jobs as it reaches full production the following year.
That same month,
IBM
announces plans to invest $300 million to build an organic chip
packaging manufacturing facility in Shanghai, China, to support the company's growing
semiconductor business.
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